Android/CyanogenMod 玩机笔记
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+ | 小米3拆解:http://en.miui.com/thread-7633-1-1.html | ||
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2013年12月11日 (三) 18:12的版本
1 缘起
手上的三星 Android 机 T959 用了快三年了,一直用原生系统,挺好用,一直没有分析的动力。
最近刷了 MIUI V5,内置了一堆的吸流量、浪费系统资源的应用,苦不堪言,该好好来解析一下整个 Android 系统了
2 T959 硬件结构
AP: SANSUNG Exynos S5PC111 (S5PC110) - ARM Cortex A8
CP: Infineon 8824 - Infineon X-GOLD 61x Baseband processor
Infineon 5703 --- 射频前端 + 模拟基带处理
Triquint TQM676021 --- Handset Tritium III PAD (power amplifier/duplexer) module for UMTS band I (IMT2100 band) --- 3G 射频功放
Triquint TQM666022 --- Handset Tritium III PAD (power amplifier/duplexer) module for UMTS Band II --- 3G 射频功放
Triquint TQM656024 --- Handset Tritium III PAD (power amplifier/duplexer) module for UMTS band IV --- 3G 射频功放
Samsung KB100D00WM - KFG8GH6Q4M 8Gb OneNAND , K4X2G323PB, K4X1G323PB and another 1G package
Samsung KLM8G4DEDD - 8G of MoviNAND
Maxim MAX8998 – Power management IC
Broadcom BCM4751 - single-chip GPS Receiver Solution
Broadcom BCM4329 – 802.11n with Bluetooth 2.1 + EDR and FM receiver
NEC MC-10170 – Elpida Memory + Camera processor
Atmel MXT224 - a 224-node highly configurable touchscreen controller which is part of Atmel's maXTouch product platform
http://www.techinsights.com/teardowns/samsung-galaxy-s-teardown/
http://www.evolife.cn/html/2011/57854.html
http://forum.xda-developers.com/showthread.php?t=1372365
小米3拆解:http://en.miui.com/thread-7633-1-1.html