Eagle Tips
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(→过孔和线宽与电流关系) |
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接地过孔必须可以承受约0.5A的电流,所以16mil的过孔至少要6个,越多越好 | 接地过孔必须可以承受约0.5A的电流,所以16mil的过孔至少要6个,越多越好 | ||
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+ | == 3D 模型库 == | ||
+ | |||
+ | * https://grabcad.com/library | ||
+ | * https://www.3dcontentcentral.com/ | ||
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2021年6月17日 (四) 11:08的版本
目录 |
1 Notes
- 力创的喷锡 PCB,2.54mm 的插针,钻孔必须为 0.9mm,0.7mm 的只能用在镀金板上!2.54mm间距的母座可用0.7mm的喷锡孔
- 力创的丝印,最小最好为 24mil, Ratio 14%
- Eagle Lib: 封装的 name 和 value 建议字符格式:vector, 16mil 8%
- Eagle Lib 字符的 name 建议:50mil, 8%
- 力创开卡槽,可能用的 0.5mm 的铣刀,因此如果是 5mm x 1mm 的槽,最好开成 5.5 - 6 mm x 1mm
力创邮票孔:
开孔最小 0.6mm,孔心到孔芯最小 1mm
力创半孔工艺:
设计时要用 PAD 焊盘孔绘制,把焊盘一半放边框线上,离边距离最低要 2MM 以上如下图:https://www.jlc.com/portal/server_guide_70.html
半孔大小范围:直径≥0.6MM,孔边到孔边≥0.6MM(单边焊环 0.127mm 以上,小于此参数工程会适当优化)
FR-4 板材参数:
- 介电常数 (Dielectric Constant): 4.58
- 介质损耗 (Loss Tangent): 0.022
- 1oz 铜,厚 0.035mm (35um)
http://www.kblaminates.com/chs/upfile/2010123017220691104.pdf
2 Change Fonts
Two steps: First smash all the parts to make sure you can access the part names, then change the font and ratio.
To smash all the parts, try:
display none tOrigin bOrigin; group all; smash (>0 0); display last;
To change the font and ratio, try:
display none tNames bNames; group all; change font vector (>0 0); change ratio 15 (>0 0); display last;
3 Export wiki
Run the DP_Exporter.ulp to create Board and Schematic PNG, a HTML table and WIKI table format:
- Load a board (You must be in the board screen, not in schematic to run the script)
- From File->Run load up DP_Exporter.ulp
4 Export BOM from brd
Run the 204BRD2XLS.ULP to create the BOM list of the *.brd file
5 Export Silkscreen to PDF
Open *.brd file
5.1 Top
display none tNames Dimension print
5.2 Bottom
display none bNames Dimension print
6 Export mnt
run mountsmt.ulp
7 过孔和线宽与电流关系
铜厚 1oz,线宽单位 mil
上升10摄氏度
- 6mil 0.2A
- 8mil 0.55A
- 12mil 0.8A
- 16mil 1.1A
设计时需要小于该值的一半考虑。
过孔的对应的导线宽度为焊盘边缘宽度,即10mil的孔,16mil的焊盘外径则对应6mil的导线。
RT5350F全开时电流为280mA,约为3.3V * 0.28A = 0.924W
其中天线发射功率为100mW,大概40mA的电流,用6mil的导线就够了。
接地过孔必须可以承受约0.5A的电流,所以16mil的过孔至少要6个,越多越好
8 3D 模型库