NB-IoT
来自Jack's Lab
（版本间的差异）
(以“== Overview == <br><br> == Refernece == * [https://zhuanlan.zhihu.com/p/28134440 NB-IOT模组和芯片] * http://carrier.huawei.com/~/media/CNBG/events/mwcs2018/v...”为内容创建页面) |
(→Overview) |
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| 第1行： | 第1行： | ||
== Overview == | == Overview == | ||
| + | |||
| + | == Chips == | ||
| + | |||
| + | === Hi2115 === | ||
| + | |||
| + | Boudica 150 | ||
| + | |||
| + | * SoC, 无需外接 MCU | ||
| + | |||
| + | * 支持 698-960/1800/2100MHz | ||
| + | |||
| + | <br> | ||
| + | |||
| + | === Hi2110 === | ||
| + | |||
| + | Boudica 120 | ||
| + | |||
| + | * SOC：BB+RF+PMU+AP+Memory | ||
| + | * 3 ARM Core：AP+CP+SP | ||
| + | |||
| + | <br> | ||
<br><br> | <br><br> | ||
2019年4月17日 (三) 14:44的版本
目录 |
1 Overview
2 Chips
2.1 Hi2115
Boudica 150
- SoC, 无需外接 MCU
- 支持 698-960/1800/2100MHz
2.2 Hi2110
Boudica 120
- SOC：BB+RF+PMU+AP+Memory
- 3 ARM Core：AP+CP+SP
3 Refernece
- NB-IOT模组和芯片
- http://carrier.huawei.com/~/media/CNBG/events/mwcs2018/v3/pdf/Morning_4_JiangWangcheng_Jointly-build-a-flourishing-ecosystem.pdf
- https://www.gsma.com/iot/wp-content/uploads/2017/03/MIoT-Ecosystem-Huawei-Quan-Yu.pdf
