ESP8266 特性
来自Jack's Lab
- 集成低功耗 32 位 CPU,可以兼作应用处理器、片上存储器和外部存储器接口 (an enhanced version of Tensilica’s L106 Diamond series)
- 10-bit ADC
- SDIO 2.0, (H) SPI, UART, I2C, I2S, IR Remote Control, PWM, GPIO
- WiFi 2.4GHz,802.11 b/g/n
- 支持 WEP、TKIP、AES 和 WAPI
- 支持 STA / AP / STA+AP
- WiFi Direct (P2P)、soft-AP
- 支持 Smart Link 快速配置 WiFi
- 集成 TCP/IP 协议栈
- STBC、 1×1 MIMO、2×1 MIMO
- 集成 TR 开关、 balun、LNA、 PA 和匹配网络
- 集成 PLL、稳压器、DCXO 和电源管理单元
- 802.11b模式下 +19.5dBm 的输出功率
- 深睡眠小于 10uA,断电泄露电流小于 5uA
- 待机状态消耗功率少于 1.0mW (DTIM3)
- 2ms 之内唤醒并传递数据包
- A-MPDU & A-MSDU 聚合 & 0.4ms 的保护间隔
- 所有内部供电均包含片上低压差线性稳压器
- 射频部件具备自动校准功能,确保芯片在所有操作条件下都呈最佳表现
- 无需工厂的优化调试
- 外部无任何射频部件
- 32-pin QFN 封装
* 802.11 b/g/n * Integrated TCP/IP protocol stack * Integrated TR switch, balun, LNA, power amplifier and matching network * Integrated PLL, regulators, and power management units * Supports antenna diversity * WiFi 2.4 GHz, support WPA/WPA2 * Support STA/AP/STA+AP operation modes * STBC, 1x1 MIMO, 2x1 MIMO * Support Smart Link Function for both Android and iOS devices * Integrated low power 32-bit MCU (an enhanced version of Tensilica’s L106 Diamond series) * Integrated 10-bit ADC * SDIO 2.0, (H) SPI, UART, I2C, I2S, IR Remote Control, PWM, GPIO * A-MPDU & A-MSDU aggregation & 0.4s guard interval * Deep sleep power <10uA, Power down leakage current < 5uA * Wake up and transmit packets in < 2ms * Standby power consumption of < 1.0mW (DTIM3) * +20 dBm output power in 802.11b mode * Operating temperature range -40C ~ 125C • FCC, CE, TELEC, WiFi Alliance, and SRRC certified