ESP8266 特性
来自Jack's Lab
（版本间的差异）
| （未显示1个用户的5个中间版本） | |||
| 第2行： | 第2行： | ||
| − | * 32- | + | * 集成低功耗 32 位 CPU，可以兼作应用处理器、片上存储器和外部存储器接口 (an enhanced version of Tensilica’s L106 Diamond series) |
| − | * SDIO 2. | + | * 10-bit ADC |
| − | + | * SDIO 2.0, (H) SPI, UART, I2C, I2S, IR Remote Control, PWM, GPIO | |
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| − | * | + | * WiFi 2.4GHz，802.11 b/g/n |
| − | + | * 支持 WEP、TKIP、AES 和 WAPI | |
| − | + | * 支持 STA / AP / STA+AP | |
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* WiFi Direct (P2P)、soft-AP | * WiFi Direct (P2P)、soft-AP | ||
| + | * 支持 Smart Link 快速配置 WiFi | ||
* 集成 TCP/IP 协议栈 | * 集成 TCP/IP 协议栈 | ||
| + | * STBC、 1×1 MIMO、2×1 MIMO | ||
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* 集成 TR 开关、 balun、LNA、 PA 和匹配网络 | * 集成 TR 开关、 balun、LNA、 PA 和匹配网络 | ||
| − | * | + | * 集成 PLL、稳压器、DCXO 和电源管理单元 |
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* 802.11b模式下 +19.5dBm 的输出功率 | * 802.11b模式下 +19.5dBm 的输出功率 | ||
| − | * | + | * 深睡眠小于 10uA，断电泄露电流小于 5uA |
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* 待机状态消耗功率少于 1.0mW (DTIM3) | * 待机状态消耗功率少于 1.0mW (DTIM3) | ||
| + | * 2ms 之内唤醒并传递数据包 | ||
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| + | * A-MPDU & A-MSDU 聚合 & 0.4ms 的保护间隔 | ||
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| + | * 所有内部供电均包含片上低压差线性稳压器 | ||
| + | * 射频部件具备自动校准功能，确保芯片在所有操作条件下都呈最佳表现 | ||
| + | * 无需工厂的优化调试 | ||
| + | * 外部无任何射频部件 | ||
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| + | * 32-pin QFN 封装 | ||
<br><br> | <br><br> | ||
| − | < | + | |
| − | + | <pre> | |
| − | < | + | * 802.11 b/g/n |
| − | < | + | * Integrated TCP/IP protocol stack |
| − | < | + | * Integrated TR switch, balun, LNA, power amplifier and matching network |
| − | < | + | * Integrated PLL, regulators, and power management units |
| − | + | * Supports antenna diversity | |
| + | * WiFi 2.4 GHz, support WPA/WPA2 | ||
| + | * Support STA/AP/STA+AP operation modes | ||
| + | * STBC, 1x1 MIMO, 2x1 MIMO | ||
| + | * Support Smart Link Function for both Android and iOS devices | ||
| + | |||
| + | * Integrated low power 32-bit MCU (an enhanced version of Tensilica’s L106 Diamond series) | ||
| + | * Integrated 10-bit ADC | ||
| + | * SDIO 2.0, (H) SPI, UART, I2C, I2S, IR Remote Control, PWM, GPIO | ||
| + | |||
| + | * A-MPDU & A-MSDU aggregation & 0.4s guard interval | ||
| + | * Deep sleep power <10uA, Power down leakage current < 5uA | ||
| + | * Wake up and transmit packets in < 2ms | ||
| + | * Standby power consumption of < 1.0mW (DTIM3) | ||
| + | |||
| + | * +20 dBm output power in 802.11b mode | ||
| + | * Operating temperature range -40C ~ 125C | ||
| + | • FCC, CE, TELEC, WiFi Alliance, and SRRC certified | ||
| + | </pre> | ||
| + | |||
<br><br> | <br><br> | ||
2026年1月19日 (一) 18:15的最后版本
- 集成低功耗 32 位 CPU，可以兼作应用处理器、片上存储器和外部存储器接口 (an enhanced version of Tensilica’s L106 Diamond series)
- 10-bit ADC
- SDIO 2.0, (H) SPI, UART, I2C, I2S, IR Remote Control, PWM, GPIO
- WiFi 2.4GHz，802.11 b/g/n
- 支持 WEP、TKIP、AES 和 WAPI
- 支持 STA / AP / STA+AP
- WiFi Direct (P2P)、soft-AP
- 支持 Smart Link 快速配置 WiFi
- 集成 TCP/IP 协议栈
- STBC、 1×1 MIMO、2×1 MIMO
- 集成 TR 开关、 balun、LNA、 PA 和匹配网络
- 集成 PLL、稳压器、DCXO 和电源管理单元
- 802.11b模式下 +19.5dBm 的输出功率
- 深睡眠小于 10uA，断电泄露电流小于 5uA
- 待机状态消耗功率少于 1.0mW (DTIM3)
- 2ms 之内唤醒并传递数据包
- A-MPDU & A-MSDU 聚合 & 0.4ms 的保护间隔
- 所有内部供电均包含片上低压差线性稳压器
- 射频部件具备自动校准功能，确保芯片在所有操作条件下都呈最佳表现
- 无需工厂的优化调试
- 外部无任何射频部件
- 32-pin QFN 封装
* 802.11 b/g/n * Integrated TCP/IP protocol stack * Integrated TR switch, balun, LNA, power amplifier and matching network * Integrated PLL, regulators, and power management units * Supports antenna diversity * WiFi 2.4 GHz, support WPA/WPA2 * Support STA/AP/STA+AP operation modes * STBC, 1x1 MIMO, 2x1 MIMO * Support Smart Link Function for both Android and iOS devices * Integrated low power 32-bit MCU (an enhanced version of Tensilica’s L106 Diamond series) * Integrated 10-bit ADC * SDIO 2.0, (H) SPI, UART, I2C, I2S, IR Remote Control, PWM, GPIO * A-MPDU & A-MSDU aggregation & 0.4s guard interval * Deep sleep power <10uA, Power down leakage current < 5uA * Wake up and transmit packets in < 2ms * Standby power consumption of < 1.0mW (DTIM3) * +20 dBm output power in 802.11b mode * Operating temperature range -40C ~ 125C • FCC, CE, TELEC, WiFi Alliance, and SRRC certified
